Circuits Assembly article: Brio engineer talks about attentive details at SMT processes

October 2008

“Paying Attention to the Small things during SMT Processes – Solder Pads & Via-holes” published on Circuits Assembly  October 2008 issue. The author is Cai, Sanqiang – Beijing Brio Engineer.

Circuits Assembly – The Journal for Surface Mount and Electronics Assembly is one of the most popular magazines in the Electronics Manufacturing sector in North America. In this magazine, you can find thoughts and analysis from some of the sharpest minds in the industry.

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